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PCB industry
One of the enterprises with the most extensive layout of process solutions in the global PCB-specific production equipment field; Covering conventional rigid multi-layer boards, high-density interconnect boards (HDI), quasi-substrate boards (SLP), and Substrate boards (IC Substrate). We offer key processes such as drilling, exposure (inner layer, outer layer, solder mask), molding, electrical performance testing, lamination and reinforcement, and automation for all specialized PCB products including flexible and rigid-flex boards (FPC&Flex-Rigid). We provide drilling solutions including mechanical drilling machines, CO2/UV/ ultrafast laser drilling machines, and LDI laser direct imaging solutions. Mechanical forming, laser forming solutions, specialized/general/high-precision testing solutions, steel sheet reinforcing machines and auxiliary material adhesion, and other multi-series and multi-type process solutions.
