紫外绿光

PRODUCT

Products and solutions

The field of lasers

The company has over a hundred different models in the laser field, with a comprehensive and rich product line, covering all types of models suitable for marking targets on various materials such as metals, non-metals, PCB boards, ics, and semiconductor wafers. As the foundation and focus of the company's business, various types of laser marking machines have extensive and in-depth industry applications and customer accumulation worldwide.
激光打标
  • Standard UV ultraviolet laser marking machine
    Standard UV ultraviolet laser marking machine

    Ultraviolet laser marking machines belong to the series of laser marking machines, but they are developed using 355nm ultraviolet lasers. This machine adopts the third-order intraccavity frequency doubling technology. Compared with infrared lasers, the focused spot of 355nm ultraviolet light is extremely small, which can greatly reduce the mechanical deformation of materials and has a small thermal impact during processing. Therefore, it is mainly used for ultra-fine marking and engraving. It is particularly suitable for application fields such as marking and micro-hole drilling of food and pharmaceutical packaging materials, high-speed division of glass materials, and complex graphic cutting of silicon wafers.

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  • Enclosed UV ultraviolet laser marking machine
    Enclosed UV ultraviolet laser marking machine

    Ultraviolet laser marking machines belong to the series of laser marking machines, but they are developed using 355nm ultraviolet lasers. This machine adopts the third-order intraccavity frequency doubling technology. Compared with infrared lasers, the focused spot of 355nm ultraviolet light is extremely small, which can greatly reduce the mechanical deformation of materials and has a small thermal impact during processing. Therefore, it is mainly used for ultra-fine marking and engraving. It is particularly suitable for application fields such as marking and micro-hole drilling of food and pharmaceutical packaging materials, high-speed division of glass materials, and complex graphic cutting of silicon wafers.

    More+